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Jae-Hyeon Park, Seong-Keun Jeong and Hyun-Ung Oh
A critical-strain-based methodology was proposed to overcome the theoretical limitations of Steinberg?s method, and its effectiveness was experimentally verified through fatigue tests of ball grid arrays, column grid arrays, and lead-type specimens on pr...
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Tae-Yong Park, Jae-Hyeon Park and Hyun-Ung Oh
Steinberg?s theory, which is based on the fatigue failure theory, has been widely used for predicting the structural safety of solder joints in aerospace electronic units under vibration during launches. However, theoretical limitations are encountered w...
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Soo-Jin Kang, Sung-Woo Park, Hye-Yoon Choi, Gu-Hyun Ryu, Jong-Pil Kim, Sung-Hoon Jung, Se-Young Kim, Hyon-Ik Lee and Hyun-Ung Oh
This paper presents the effectiveness of the thermo-mechanical design of a high-speed digital receiver unit (HSDRU) developed for spaceborne synthetic aperture radar applications. The main features of HSDRU?s thermo-mechanical design include the thermal ...
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Jieshi Chen, Yongzhi Zhang, Zhishui Yu, Peilei Zhang, Wanqin Zhao, Jin Yang and Di Wu
In this work, the effects of electroplated Cu (EP Cu) and Cu addition (0.7%) in Sn solder on the intermetallic compounds (IMCs) growth and void formation were clarified by comparison with solder joints comprising of high purity Cu (HP Cu) substrate and p...
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Ephraim Suhir and Reza Ghaffarian
In this review, some major aspects of the current underfill technologies for flip-chip (FC) and fine-pitch-ball-grid-array (FPBGA), including chip-size packaging (CSP), are addressed, with an emphasis on applications, such as aerospace electronics, for w...
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Zhong, Z.W.; Tee, T.Y.
Pág. 175 - 183
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S.J. Wang and C.Y. Liu
Pág. 347 - 350
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