REVISTA

PROCEEDINGS OF THE IEEE

ISSN: 0018-9219 Frecuencia: 12 Formato: Impresa

Tablas de contenido

12 artículos asociados

Volumen 89 Número 5 Parte 0 Año 2001

SPECIAL ISSUE ON INTERCONNECTIONS -- ADDRESSING THE NEXT CHALLENGE OF IC TECHNOLOGY (PART II: DESIGN, CHARACTERIZATION, AND MODELING) - Scanning the Special Issue on Interconnections -- Addressing the Next Challenge of IC Technology (Part II: Design, Char	Solicitud
Schutt-Ainé, J E; Kang, S-M
Pág. 583 - 585

SPECIAL ISSUE ON INTERCONNECTIONS -- ADDRESSING THE NEXT CHALLENGE OF IC TECHNOLOGY (PART II: DESIGN, CHARACTERIZATION, AND MODELING) - PAPERS - High-Performance Interconnects: An Integration Overview (Invited Paper)	Solicitud
Schutt-Ainé, J E; Kang, S-M; Havemann, R H; Hutchby, J A
Pág. 586 - 601

SPECIAL ISSUE ON INTERCONNECTIONS -- ADDRESSING THE NEXT CHALLENGE OF IC TECHNOLOGY (PART II: DESIGN, CHARACTERIZATION, AND MODELING) - PAPERS - 3-D ICs: A Novel Chip Design for Improving Deep-Submicrometer Interconnect Performance and Systems-on-Chip Int	Solicitud
Schutt-Ainé, J E; Kang, S-M; Banerjee, K; Souri, S J; Kapur, P; Sarasw
Pág. 602 - 633

SPECIAL ISSUE ON INTERCONNECTIONS -- ADDRESSING THE NEXT CHALLENGE OF IC TECHNOLOGY (PART II: DESIGN, CHARACTERIZATION, AND MODELING) - PAPERS - Analytical Modeling and Characterization of Deep-Submicrometer Interconnect (Invited Paper)	Solicitud
Schutt-Ainé, J E; Kang, S-M; Sylvester, D; Hu, C
Pág. 634 - 664

SPECIAL ISSUE ON INTERCONNECTIONS -- ADDRESSING THE NEXT CHALLENGE OF IC TECHNOLOGY (PART II: DESIGN, CHARACTERIZATION, AND MODELING) - PAPERS - Clock Distribution Networks in Synchronous Digital Integrated Circuits (Invited Paper)	Solicitud
Schutt-Ainé, J E; Kang, S-M; Friedman, E G
Pág. 665 - 692

SPECIAL ISSUE ON INTERCONNECTIONS -- ADDRESSING THE NEXT CHALLENGE OF IC TECHNOLOGY (PART II: DESIGN, CHARACTERIZATION, AND MODELING) - PAPERS - Simulation of High-Speed Interconnects (Invited Paper)	Solicitud
Schutt-Ainé, J E; Kang, S-M; Achar, R; Nakhla, M S
Pág. 693 - 728

SPECIAL ISSUE ON INTERCONNECTIONS -- ADDRESSING THE NEXT CHALLENGE OF IC TECHNOLOGY (PART II: DESIGN, CHARACTERIZATION, AND MODELING) - PAPERS - Parasitic Extraction: Current State of the Art and Future Trends (Invited Paper)	Solicitud
Schutt-Ainé, J E; Kang, S-M; Kao, W H; Lo, C-Y; Basel, M; Singh, R
Pág. 729 - 739

SPECIAL ISSUE ON INTERCONNECTIONS -- ADDRESSING THE NEXT CHALLENGE OF IC TECHNOLOGY (PART II: DESIGN, CHARACTERIZATION, AND MODELING) - PAPERS - Progress in the Methodologies for the Electrical Modeling of Interconnects and Electronic Packages (Invited Pa	Solicitud
Schutt-Ainé, J E; Kang, S-M; Ruehli, A E; Cangellaris, A C
Pág. 740 - 771

SPECIAL ISSUE ON INTERCONNECTIONS -- ADDRESSING THE NEXT CHALLENGE OF IC TECHNOLOGY (PART II: DESIGN, CHARACTERIZATION, AND MODELING) - PAPERS - Moment Computation of Lumped and Distributed Coupled RC Trees with Application to Delay and Crosstalk Estimati	Solicitud
Schutt-Ainé, J E; Kang, S-M; Yu, Q; Kuh, E S
Pág. 772 - 788

SPECIAL ISSUE ON INTERCONNECTIONS -- ADDRESSING THE NEXT CHALLENGE OF IC TECHNOLOGY (PART II: DESIGN, CHARACTERIZATION, AND MODELING) - COMMENTS - Correction to "Semiconductor Characterization and Analytical Technology"	Solicitud
Schutt-Ainé, J E; Kang, S-M; Shaffner, T J
Pág. 789 - 789

SPECIAL ISSUE ON INTERCONNECTIONS -- ADDRESSING THE NEXT CHALLENGE OF IC TECHNOLOGY (PART II: DESIGN, CHARACTERIZATION, AND MODELING) - SCANNING OUR PAST FROM LONDON - Galileo Ferraris and Alternating Current	Solicitud
Schutt-Ainé, J E; Kang, S-M; Bowers, B
Pág. 790 - 792

SPECIAL ISSUE ON INTERCONNECTIONS -- ADDRESSING THE NEXT CHALLENGE OF IC TECHNOLOGY (PART II: DESIGN, CHARACTERIZATION, AND MODELING) - FUTURE SPECIAL ISSUES/SPECIAL SECTIONS OF THE PROCEEDINGS	Solicitud
Schutt-Ainé, J E; Kang, S-M
Pág. 793 - 793