3   Artículos

 
en línea
Marc Ladegourdie and Jonathan Kua    
Open Platform Communications Unified Architecture (OPC UA) incorporates a wide range of features and covers most of the requirements for a platform-independent interoperability standard which can be used to transmit data and information from the factory ... ver más
Revista: IoT    Formato: Electrónico

 
en línea
Jun Dong and Chunming Ye    
Production scheduling of semiconductor wafer manufacturing is a challenging research topic in the field of industrial engineering. Based on this, the green manufacturing collaborative optimization problem of the semiconductor wafer distributed heterogene... ver más
Revista: Applied Sciences    Formato: Electrónico

« Anterior     Página: 1 de 1     Siguiente »