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Dominik Schäfer
The numerical assessment of T-tail flutter requires a nonlinear description of the structural deformations when the unsteady aerodynamic forces comprise terms from lifting surface roll motion. For linear flutter, a linear deformation description of the v...
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Peter L. Bishay and Christian Aguilar
Although the benefits of morphing wings have been proven in many studies in the last few decades, the wing skin design remains one of the challenges to advancing and implementing the morphing technology. This is due to the conflicting design requirements...
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Pedro J. Sousa, Francisco Barros, Paulo J. Tavares and Pedro M. G. P. Moreira
Rotating structures are important and commonly used in the transportation and energy generation fields, where a better understanding of the deformations these structures endure is essential for both the design and maintenance phases. This work presents a...
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André Furtado, Hugo Rodrigues, António Arêde and Humberto Varum
Different retrofitting techniques have been developed and proposed to prevent the masonry infill walls (MIW) out-of-plane collapse. Many other authors confirmed that these types of elements are vulnerable when subjected to earthquake loadings, leading to...
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Brad D. Weldon, Paola Bandini, Michael J. McGinnis, Eduardo Dávila and Diego I. García Vera
Adobe is a traditional construction technique found in historic and new construction throughout the world, often in earthquake-prone regions. Adobe structures are particularly susceptible to seismic forces due to their substantial mass and low tensile ca...
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Yu Zhou, Wu-Gui Jiang, Duo-Sheng Li and Qing-Hua Qin
The mechanical behavior of nanocomposites consisting of highly ordered nanoporous nickel (HONN) and its carbon nanotube (CNT)-reinforced composites (CNHONNs) subjected to a high temperature of 900 K is investigated via molecular dynamics (MD) simulations...
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Meng-Chieh Liao, Pu-Shan Huang, Yi-Hsien Lin, Ming-Yi Tsai, Chen-Yu Huang and Te-Chin Huang
Measurements of the curvatures and warpages of a printed circuit board (PCB) during a thermal solder reflow process using strain gauges are proposed in this study. In the experiments, a shadow moiré is used for measuring the out-of-plane deformations (or...
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