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Eitan N. Shauly and Sagee Rosenthal
The continuous scaling needed for higher density and better performance has introduced some new challenges to the planarity processes. This has resulted in new definitions of the layout coverage rules developed by the foundry and provided to the designer...
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Krayyem Al-Hajaya,Mohammad Saleh Altarawneh,Bayan Altarawneh
Pág. 109 - 116
This study examines the level and quality of the disclosures of intellectual capital (IC) by listed companies in Jordan as a case for emerging economies, especially those from Arab nations. Using content analysis, 2016?s annual reports of all 215 listed ...
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Yun Liu, Zhe Yan, Yijie Cheng and Xuanting Ye
With the intensification of international competition, there are many international technological collaborations in the integrated circuit manufacturing (ICM) industry. The importance of improving the level of international technological collaboration is...
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Marta Vilardell, Jordina Fornell, Jordi Sort, Roxana Vlad, Juan Carlos Fernández, Joaquim Puig, Alexander Usoskin, Anna Palau, Teresa Puig, Xavier Obradors and Albert Calleja
The implementation of the Chemical Solution Deposition (CSD) methodology with the Drop on Demand (DoD) inkjet printing (IJP) technology has been successfully employed to develop a Solution Deposition Planarization (SDP) method. We have used nanocrystalli...
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Mary Fischer, Treba Marsh
The revised definition of an asset by the FASB and GASB gives way to the recognition of the fair value of another off-balance sheet value. Interest in recognizing intellectual capital as an asset of the organization has grown out of dissatisfaction with ...
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Kun-Lin Hsieh, Lee-Ing Tong and Min-Chia
Pág. 765 - 776
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