12   Artículos

 
en línea
Kuo-Ing Hwu, Jenn-Jong Shieh and Pin-Jung Chen    
In this paper, a thermoelectric conversion system for multiple heat sources is proposed. For design convenience, the overall system employs only a single-stage converter. Such a converter uses coupling inductors and switched capacitors to increase the vo... ver más
Revista: Applied Sciences    Formato: Electrónico

 
en línea
Min-Su Kim, Youngoo Yang, Hyungmo Koo and Hansik Oh    
To improve the performance of analog, RF, and digital integrated circuits, the cutting-edge advanced CMOS technology has been widely utilized. We successfully designed and implemented a high-speed and low-power serial-to-parallel (S2P) converter for 5G a... ver más
Revista: Applied Sciences    Formato: Electrónico

 
en línea
Pedro Carvalhaes-Dias, Flávio J.O. Morais, Luís F. C. Duarte, Andreu Cabot and J. A. Siqueira Dias    
We present an autonomous sensor to measure soil water content that uses a single heat pulse probe based on a transistor encapsulated in a porous block. The sensor uses a bipolar junction transistor, which performs as both a heating and temperature-sensin... ver más
Revista: Applied Sciences    Formato: Electrónico

 
en línea
Richard Pitwon, Kai Wang, Akira Yamauchi, Takaaki Ishigure, Henning Schröder, Marcel Neitz and Mayank Singh    
Optical printed circuit board (OPCB) waveguide materials and fabrication methods have advanced considerably over the past 15 years, giving rise to two classes of embedded planar graded index waveguide based on polymer and glass. We consider the performan... ver más
Revista: Applied Sciences    Formato: Electrónico

 
en línea
Burhan Khurshid,Roohie Naaz Mir     Pág. 33 - 40
Modern Field Programmable Gate Arrays (FPGA) are fast moving into the consumer market and their domain has expanded from prototype designing to low and medium volume productions. FPGAs are proving to be an attractive replacement for Application Specific ... ver más

 
usuarios registrados
Diodato, Philip W     Pág. 118 - 127
Revista: IEEE COMMUNICATIONS MAGAZINE    Formato: Impreso

 
usuarios registrados
Tserng, H-Q; Witkowski, L C; Ketterson, A A; Saunier, P; Jones, T     Pág. 2604 - 2610

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