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Toms Salgals, Janis Alnis, Oskars Ozolins, Alexey V. Andrianov, Elena A. Anashkina, Inga Brice, Roberts Berkis, Xiaodan Pang, Aleksejs Udalcovs, Jurgis Porins, Sandis Spolitis and Vjaceslavs Bobrovs
Kerr optical frequency combs (OFCs) based on silica microsphere whispering gallery mode resonator (WGMR) have various applications where they are used as a light source. For telecommunication purposes, WGMR-based Kerr-OFC comb generators can be physicall...
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Oskars Ozolins, Xiaodan Pang, Aleksejs Udalcovs, Richard Schatz, Sandis Spolitis, Vjaceslavs Bobrovs, Gunnar Jacobsen and Sergei Popov
We experimentally evaluate the high-speed on?off keying (OOK) and four-level pulse amplitude modulation (PAM4) transmitter?s performance in C-band for short-reach optical interconnects. We demonstrate up to 100 Gbaud OOK and PAM4 transmission over a 400 ...
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Konstantinos Papatryfonos, David R. Selviah, Avi Maman, Kobi Hasharoni, Antoine Brimont, Andrea Zanzi, Jochen Kraft, Victor Sidorov, Marc Seifried, Yannick Baumgartner, Folkert Horst, Bert Jan Offrein, Katarzyna Lawniczuk, Ronald G. Broeke, Nikos Terzenidis, George Mourgias-Alexandris, Mingchu Tang, Alwyn J. Seeds, Huiyun Liu, Pablo Sanchis, Miltiadis Moralis-Pegios, Thanasis Manolis, Nikos Pleros, Konstantinos Vyrsokinos, Bogdan Sirbu, Yann Eichhammer, Hermann Oppermann and Tolga Tekinadd Show full author list remove Hide full author list
We report recent advances in photonic?electronic integration developed in the European research project L3MATRIX. The aim of the project was to demonstrate the basic building blocks of a co-packaged optical system. Two-dimensional silicon photonics array...
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Xin Mu, Sailong Wu, Lirong Cheng and H.Y. Fu
Silicon photonics has drawn increasing attention in the past few decades and is a promising key technology for future daily applications due to its various merits including ultra-low cost, high integration density owing to the high refractive index of si...
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Krassimir Panajotov and Richard Schatz
VCSELs are widely employed in Fiber to the Home links, computer networks and optical interconnects because of their low power consumption, small footprint, high reliability, easy packaging, single longitudinal mode emission, high modulation speed, low co...
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Giannis Kanakis, Nikos Iliadis, Wouter Soenen, Bart Moeneclaey, Nikolaos Argyris, Dimitrios Kalavrouziotis, Silvia Spiga, Paraskevas Bakopoulos and Hercules Avramopoulos
The soaring demand for higher speeds in datacenters to address the relentless growth of the global IP traffic places optical interconnects in the spotlight. In this manuscript, we present a high-speed optical transceiver for intra-datacenter connectivity...
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Jun Yeong Jang, Min Su Kim, Chang-Lin Li and Tae Hee Han
To address the performance bottleneck in metal-based interconnects, hybrid optical network-on-chip (HONoC) has emerged as a new alternative. However, as the size of the HONoC grows, insertion loss and crosstalk noise increase, leading to excessive laser ...
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Naohiro Kohmu, Toshiaki Takai, Norio Chujo and Hideo Arimoto
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Isabelle Jauberteau, Richard Mayet, Julie Cornette, Denis Mangin, Annie Bessaudou, Pierre Carles, Jean Louis Jauberteau and Armand Passelergue
The physical properties including the mechanical, optical and electrical properties of Ti nitrides and silicides are very attractive for many applications such as protective coatings, barriers of diffusion, interconnects and so on. The simultaneous forma...
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Yang, Y.; Wang, J.
Pág. 51 - 66
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