|
|
|
|
|
Jun Watanabe, Kenji Hatsuzawa, Shigeyuki Ogata, Shinichi Yoshida and Ikuo Shohji
The use of Sn-3mass%Ag-0.5mass%Cu lead-free solder (SAC305) has become common. Since SAC305 has a higher content of tin than conventional tin?lead eutectic solder, erosion of the Fe plating layer used in the solder iron tip and the point soldering machin...
ver más
|
|
|
|
|