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Lucas Kwai Hong Lui and C. K. M. Lee
This research investigated a mathematical model of earphone design with principal component analysis. Along with simplifying the design problem, a predictive model for the sound quality indicators, namely, total harmonic distortion, power of output, rang...
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Mira Naftaly, Gian Savvides, Fawwaz Alshareef, Patrick Flanigan, GianLuc Lui, Marian Florescu and Ruth Ann Mullen
Non-destructive porosity measurements of 3D printed materials by terahertz time-domain spectroscopy.
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Hwan Ing Hee, BT Balamurali, Arivazhagan Karunakaran, Dorien Herremans, Onn Hoe Teoh, Khai Pin Lee, Sung Shin Teng, Simon Lui and Jer Ming Chen
(1) Background: Cough is a major presentation in childhood asthma. Here, we aim to develop a machine-learning based cough sound classifier for asthmatic and healthy children. (2) Methods: Children less than 16 years old were randomly recruited in a Child...
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Lui S. Wong and Moncef L. Nehdi
Reinforced concrete pipe (RCP) standard guidelines and industry practice have rather been disconnected from the end-users? expectations. No genuine effort has so far been made to create synergy between the expertise gained and advances made around the wo...
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Gilson de Brito Silva,Gabriel Henrique Lui,Elaine Nolasco Ribeiro,Tânia Cristina da Silva Cruz,Luiz Felippe Salemi
Pág. 36 - 42
O Brasil é um grande gerador de resíduos sólidos. Dentre esses, destacam-se os resíduos orgânicos que, se destinados ao processo de compostagem, podem reduzir o volume de resíduos destinados aos aterros de modo a diminuir a pressão sobre esses. Nesse sen...
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Jongdeog Lee, Kelvin Marcus, Tarek Abdelzaher, Md Tanvir A. Amin, Amotz Bar-Noy, William Dron, Ramesh Govindan, Reginald Hobbs, Shaohan Hu, Jung-Eun Kim, Lui Sha, Shuochao Yao and Yiran Zhao
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Michael Kersten, Tatiana Y. Reich, Ka H. Lui, Gerald T. Schmidt and Jörg Göttlicher
Pág. 509 - 520
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C. Fiorini, A. Gola, R. Peloso, A. Longoni, P. Lechner, H. Soltau, L. Strüder, L. Ottobrini, C. Martelli, R. Lui, L. Madaschi, and S. Belloli
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David Burton et Allessandro Zanello
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Chee Wei Tan; Dah-Ming Chiu; Lui, J.C.S.; Yau, D.K.Y.
Pág. 983 - 995
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