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Haotao Wang, Haijun Zhang, Ming Zhou, Chengbo Gu, Sutong Bai and Hao Lin
SiCp/Al composites are used in the aerospace, automotive, and electronics fields, among others, due to their excellent physical and mechanical properties. However, as they are hard-to-machine materials, poor surface quality has become a major limitation ...
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Khansaa Dawood Salman, Wisam Abed Kattea Al-Maliki, Falah Alobaid and Bernd Epple
This work aims to define the microstructure and to study the mechanical properties of an Al matrix incorporated with various amounts of Fe2O3 (3, 6, 9, 12 and 15 wt.%) with a constant amount of Ag at 1 wt.%. Al/Fe2O3 + Ag hybrid nano-composite samples ar...
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Ephraim Suhir and Reza Ghaffarian
In this review, some major aspects of the current underfill technologies for flip-chip (FC) and fine-pitch-ball-grid-array (FPBGA), including chip-size packaging (CSP), are addressed, with an emphasis on applications, such as aerospace electronics, for w...
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