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Suzana Petrovic, Nevena Bo?inovic, Vladimir Rajic, Danijela Stanisavljevic Ninkovic, Danilo Kisic, Milena J. Stevanovic and Emmanuel Stratakis
Arranged patterns obtained via ultrafast laser processing on the surface of Ti/Cu/Ti/Si and Ti/Zr/Ti/Si thin-film systems are reported. Two differently designed multilayer thin films Ti/Cu/Ti/Si and Ti/Zr/Ti/Si were deposited on silicon using the ion spu...
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Chen Lin, Teng Zhan, Junxi Wang, Jinmin Li, Zhiqiang Liu and Xiaoyan Yi
Conventionally, Cu is preferred over Al to fabricate integrated inductors with higher quality factors on either silicon or sapphire substrates, profiting from its lower resistivity. However, after investigating and comparing these two kinds of metal mult...
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Wei Chen, Jing Liu, Wen-Zhuang Ma, Gao-Xiang Yu, Jing-Qian Chen, Hao-Yuan Cai and Cheng-Fu Yang
Solar energy is the most important clean energy source on the earth, and many research studies have been conducted to investigate solar-energy collection. This article numerically proposes a new ultra-broadband solar absorber with structures of multilaye...
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Jian-Fu Tang, Chun-Hong Huang, Ching-Yen Lin, Fu-Chi Yang and Chi-Lung Chang
We investigated the effects of substrate rotation speed on the structural and mechanical properties of CrN/CrAlSiN multilayer coatings produced using high-power impulse magnetron sputtering (HiPIMS) on silicon and high-speed steel (HSS) substrates. Struc...
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Bogdan Demchyna,Mykhailo Surmai,Roman Tkach,Vasylyna Hula,Roman Kozak
Pág. 52 - 59
The study of glass multilayer columns made of ordinary glass using triplexing technology. The main disadvantage of using ordinary glass is the fragile nature of its destruction, it breaks instantly. To avoid this effect, triplexing technology is used: th...
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Igor Nevliudov, Valeriy Gurin, Dmytro Gurin
Pág. 57 - 61
The subject of the study is oxide-semiconductor capacitors, which are widely used in the manufacture of electronic equipment. The goal of the study is to determine the main causes of failures of oxide-semiconductor capacitors at the production and operat...
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Yang, H Y D
Pág. 428 - 435
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