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Dongik Shin, Jeong-Yong Lee, Hoejun Heo and Chung-Yun Kang
Microstructural evolution and formation mechanism of reaction layer for 22MnB5 steel hot-dipped in Al–10Si (in wt %) alloy was investigated. The microstructural identification of the reaction layer was characterized via transmission electron micros...
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Jieshi Chen, Yongzhi Zhang, Zhishui Yu, Peilei Zhang, Wanqin Zhao, Jin Yang and Di Wu
In this work, the effects of electroplated Cu (EP Cu) and Cu addition (0.7%) in Sn solder on the intermetallic compounds (IMCs) growth and void formation were clarified by comparison with solder joints comprising of high purity Cu (HP Cu) substrate and p...
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Qixiang Fan, Haojun Yu, Tiegang Wang and Yanmei Liu
A Si doped Pt modified aluminide coating was prepared by electroplating and the chemical vapour deposition method. The microstructure and oxidation resistance of the coating were studied, with a single Pt modified aluminide coating as a reference. The re...
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Liping Xu, Jinbing Song, Xiaofeng Zhang, Changguang Deng, Min Liu and Kesong Zhou
There is an urgent need to improve the corrosion resistance of WC-based cermet coatings in different corrosive environments. The main objective of this work was to investigate the microstructure and evaluate the corrosion resistance in neutral, acidic, a...
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Sung-Yun Kwak, Jung-Gil Yun, Jae-Hyeong Lee, Dong-Ik Shin and Chung-Yun Kang
In laser welding and hot stamping Al-Si-coated boron steel, there is a problem that the strength of the joint is lowered due to ferrite formation in the fusion zone. The purpose of this study is to develop an Al-7 wt.% Mn hot-dip coating in which Mn, an ...
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