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Chung-Ke Yu, Ding-Bing Lin and Hsin-Piao Lin
A novel wideband common-mode (CM) suppression filter is proposed for high-speed transmission. The filter is embedded in 3 10 mm × 10 mm layers of a printed circuit board (PCB) that combines a mushroom structure and a defected corrugated reference plane s...
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Wenwei Zhao, Suprith Reddy Gurudu, Shayan Taheri, Shajib Ghosh, Mukhil Azhagan Mallaiyan Sathiaseelan and Navid Asadizanjani
Printed circuit board (PCB) assurance in the optical domain is a crucial field of study. Though there are many existing PCB assurance methods using image processing, computer vision (CV), and machine learning (ML), the PCB field is complex and increasing...
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Tae-Yong Park, Seok-Jin Shin and Hyun-Ung Oh
In a previous study, a high-damping printed circuit board (PCB) implemented by multilayered viscoelastic acrylic tapes was investigated to increase the fatigue life of solder joints of electronic packages by vibration attenuation in a random vibration en...
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Shankar Bhattarai, Ji-Seong Go, Hongrae Kim and Hyun-Ung Oh
The structural safety of solar cells mounted on deployable solar panels in the launch vibration environment is a significant aspect of a successful CubeSat mission. This paper presents a novel highly damped deployable solar panel module that is effective...
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Leandro H. de S. Silva, Agostinho A. F. Júnior, George O. A. Azevedo, Sergio C. Oliveira and Bruno J. T. Fernandes
The technological growth of the last decades has brought many improvements in daily life, but also concerns on how to deal with electronic waste. Electrical and electronic equipment waste is the fastest-growing rate in the industrialized world. One of th...
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Young-Gyu Kim and Tae-Hyoung Park
The contribution of this paper is to propose a dual-stream convolutional neural network (CNN) using two solder regions for inspections of surface mount technology (SMT) assembly defects. We extract two solder regions from a printed circuit board (PCB) im...
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Shengping Lv, Rongheng Xian, Denghui Li, Binbin Zheng and Hong Jin
The application of the work is to optimize the material feeding of a printed circuit board (PCB) template and therefore reduce the comprehensive cost caused by surplus and supplemental feeding.
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Meng-Chieh Liao, Pu-Shan Huang, Yi-Hsien Lin, Ming-Yi Tsai, Chen-Yu Huang and Te-Chin Huang
Measurements of the curvatures and warpages of a printed circuit board (PCB) during a thermal solder reflow process using strain gauges are proposed in this study. In the experiments, a shadow moiré is used for measuring the out-of-plane deformations (or...
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Eduardo Rodríguez Araque,Roberto G. Rojas. Ohio University, Fundación universitaria Cafam, EEUU, Colombia
Pág. 167 - 176
Presentamos en este artículo un arreglo de antenas MIMO (multiple-input-multiple-output) que opera en la banda de 2.6 GHz, una de las bandas de operación de Long Term Evolution (LTE), para sistemas de comunicaciones móviles inalámbricas con técnicas de a...
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