2   Artículos

SPECIAL ISSUE ON INTERCONNECTIONS -- ADDRESSING THE NEXT CHALLENGE OF IC TECHNOLOGY (PART II: DESIGN, CHARACTERIZATION, AND MODELING) - PAPERS - 3-D ICs: A Novel Chip Design for Improving Deep-Submicrometer Interconnect Performance and Systems-on-Chip Int

Revista: PROCEEDINGS OF THE IEEE    Formato: Impreso

Tabla de contenido: Vol: 89 Num: 5 Par: 0 Año: 2001

Interconnect Limits on Gigascale Integration (GSI) in the 21st Century (Invited Paper)

Revista: PROCEEDINGS OF THE IEEE    Formato: Impreso

Tabla de contenido: Vol: 89 Num: 3 Par: 0 Año: 2001