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Zikun Ding, Zhichao Wang, Bowen Zhang, Guo-Quan Lu and Yun-Hui Mei
Electrochemical migration (ECM) of sintered nano-Ag could be a serious reliability concern for power devices with high-density packaging. An anti-ECM nano-Ag-SiOx paste was proposed by doping 0.1wt% SiOx nanoparticles rather than previously used expensiv...
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