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Wen Ge, Wensheng Li, Rihong Li, Yifan Dong, Ziming Zeng, Hui Cao, Longlin Yu, Zhijie Wen and Jin He
The uniformity and microstructure of the copper deposition in the high aspect ratio plated through holes (penetrating holes) are crucial for the performance of printed circuit board. We systematically investigated the effects of reverse pulse parameters ...
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