9   Artículos

 
en línea
Hideto Kayashima and Hideharu Amano    
The building block computation system is constructed by stacking various chips three-dimensionally. The stacked chips incorporate the same TCI IP (Through Chip Interface Intellectual Property) but cannot provide identical characteristics, requiring adjus... ver más
Revista: Journal of Low Power Electronics and Applications    Formato: Electrónico

 
en línea
João V. Roque, João D. Lopes, Mário P. Véstias and José T. de Sousa    
Open-source processors are increasingly being adopted by the industry, which requires all sorts of open-source implementations of peripherals and other system-on-chip modules. Despite the recent advent of open-source hardware, the available open-source c... ver más
Revista: Algorithms    Formato: Electrónico

 
en línea
Shih-Ming Wang, Chun-Yi Lee, Hariyanto Gunawan and Chin-Cheng Yeh    
This study proposes a hybrid optimization method which can help users to find optimal cutting parameters which will provide better efficiency and lower power consumption for a milling process. Empirical models including performance-power consumption char... ver más
Revista: Applied Sciences    Formato: Electrónico

 
en línea
Miraal Kamal, Manal Atif, Hafsa Mujahid, Tamer Shanableh, A. R. Al-Ali and Ahmad Al Nabulsi    
The advent of smart sensors, single system-on-chip computing devices, Internet of Things (IoT), and cloud computing is facilitating the design and development of smart devices and services. These include smart meters, smart street lightings, smart gas st... ver más
Revista: Future Internet    Formato: Electrónico

 
en línea
Waqas Saleem, Muhammad Zain-ul-abdein, Hassan Ijaz, Abdullah Salmeen Bin Mahfouz, Anas Ahmed, Muhammad Asad and Tarek Mabrouki    
In dry turning operation, various parameters influence the cutting force and contribute in machining precision. Generally, the numerical cutting models are adopted to establish the optimum cutting parameters and results are substantiated with the experim... ver más
Revista: Applied Sciences    Formato: Electrónico

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