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Claudia Mezzalira, Fosca Conti, Danilo Pedron and Raffaella Signorini
The growing interest in improving optoelectronic devices requires continuous research of the materials and processes involved in manufacturing. From a chemical point of view, the study of this sector is crucial to optimize existing manufacturing processe...
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Tareq Ibrahim Al-Ma'aiteh, Oliver Krammer and Balázs Illés
Enhancing design rules of complex printed circuit boards?electronic assembly process optimization in the early design phase.
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Maximilian Schmid, Sri Krishna Bhogaraju, E Liu and Gordon Elger
Reliability is one of the major requirements for power and opto-electronic devices across all segments. High operation temperature and/or high thermomechanical stress cause defects and degradation of materials and interconnects, which may lead to malfunc...
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Shih-Ying Chang, Jun-Yen Lee, Yan-Hua Huang and An-Ban Wu
In this study, AZ31 magnesium alloy and 6061 aluminum alloy were joined with Sn-xZn (x = 5, 10, 20 and 30 wt.%) fillers containing trace rare earth elements at 250 °C in air without the use of flux or a wetting layer. The bond shear strengths of AZ31 mag...
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Pol Ribes-Pleguezuelo, Denis Guilhot, Marta Gilaberte Basset, Erik Beckert, Ramona Eberhardt and Andreas Tünnermann
1960 is the birth year of both the laser and the Mars exploration missions. Eleven years passed before the first successful landing on Mars, and another six before the first rover could explore the planet?s surface. In 2011, both technologies were reunit...
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Jun Watanabe, Kenji Hatsuzawa, Shigeyuki Ogata, Shinichi Yoshida and Ikuo Shohji
The use of Sn-3mass%Ag-0.5mass%Cu lead-free solder (SAC305) has become common. Since SAC305 has a higher content of tin than conventional tin?lead eutectic solder, erosion of the Fe plating layer used in the solder iron tip and the point soldering machin...
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Hannes Fugmann, Paolo Di Lauro, Aniket Sawant and Lena Schnabel
Enhancing the heat transfer surface by usage of cellular metal structures, such as foams or wire structures, might allow enlarging the surface area, increasing the heat transfer coefficients, decreasing the material utilization, and enabling the flexibil...
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W. Liu et al.
Pág. 50 - 59
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Cullison, A.
Pág. 37 - 41
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