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Hsiang-Chen Hsu, Shaw-Yuan Wang, Li-Ming Chu
Pág. 51 - 58
In this paper, a 3-D finite element prediction on aluminum pad squeeze during copper wirebonding process for high power IC package is presented. ANSYS Parametric Design Language (APDL) has been implemented on modelling, mesh density, boundary condition (...
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Hsiang-Chen Hsu, Li-Ming Chu, Zong-Kun Wang, Shu-Chi Tsao
Pág. 40 - 45
In this paper, a SCARA robot arm with vision system has been developed to improve the accuracy of pick-and-place the surface mount device (SMD) on PCB during surface mount process. Position of the SCARA robot can be controlled by using coordinate auto-co...
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Li-Ming Chu, Jaw-Ren Lin, Wang-Long Li and Yuh-Ping Chang
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Yawei Hu, Liuhe Li, Ming Xu, Youming Liu, Xun Cai, Ian G. Brown, and Paul K. Chu
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