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Jieshi Chen, Yongzhi Zhang, Zhishui Yu, Peilei Zhang, Wanqin Zhao, Jin Yang and Di Wu
In this work, the effects of electroplated Cu (EP Cu) and Cu addition (0.7%) in Sn solder on the intermetallic compounds (IMCs) growth and void formation were clarified by comparison with solder joints comprising of high purity Cu (HP Cu) substrate and p...
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Kai Yue, Fuzhong Wu, Wanqin Yang, Chuan Zhang, Yan Peng, Bo Tan, Zhenfeng Xu and Chunping Huang
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Shu Liao, Xiangyin Ni, Wanqin Yang, Han Li, Bin Wang, Changkun Fu, Zhenfeng Xu, Bo Tan and Fuzhong Wu
Longstanding observations suggest that dissolved materials are lost from fresh litter through leaching, but the role of soil fauna in controlling this process has been poorly documented. In this study, a litterbag experiment employing litterbags with dif...
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