14   Artículos

Full-Wave Analysis and Modeling of Multiconductor Transmission Lines via 2-D-FDTD and Signal-Processing Techniques

Revista: IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES    Formato: Impreso

Tabla de contenido: Vol: 50 Num: 2 Par: 0 Año: 2002

SPECIAL ISSUE ON INTERCONNECTIONS -- ADDRESSING THE NEXT CHALLENGE OF IC TECHNOLOGY (PART II: DESIGN, CHARACTERIZATION, AND MODELING) - Scanning the Special Issue on Interconnections -- Addressing the Next Challenge of IC Technology (Part II: Design, Char

Revista: PROCEEDINGS OF THE IEEE    Formato: Impreso

Tabla de contenido: Vol: 89 Num: 5 Par: 0 Año: 2001

SPECIAL ISSUE ON INTERCONNECTIONS -- ADDRESSING THE NEXT CHALLENGE OF IC TECHNOLOGY (PART II: DESIGN, CHARACTERIZATION, AND MODELING) - PAPERS - High-Performance Interconnects: An Integration Overview (Invited Paper)

Revista: PROCEEDINGS OF THE IEEE    Formato: Impreso

Tabla de contenido: Vol: 89 Num: 5 Par: 0 Año: 2001

SPECIAL ISSUE ON INTERCONNECTIONS -- ADDRESSING THE NEXT CHALLENGE OF IC TECHNOLOGY (PART II: DESIGN, CHARACTERIZATION, AND MODELING) - PAPERS - 3-D ICs: A Novel Chip Design for Improving Deep-Submicrometer Interconnect Performance and Systems-on-Chip Int

Revista: PROCEEDINGS OF THE IEEE    Formato: Impreso

Tabla de contenido: Vol: 89 Num: 5 Par: 0 Año: 2001

SPECIAL ISSUE ON INTERCONNECTIONS -- ADDRESSING THE NEXT CHALLENGE OF IC TECHNOLOGY (PART II: DESIGN, CHARACTERIZATION, AND MODELING) - PAPERS - Analytical Modeling and Characterization of Deep-Submicrometer Interconnect (Invited Paper)

Revista: PROCEEDINGS OF THE IEEE    Formato: Impreso

Tabla de contenido: Vol: 89 Num: 5 Par: 0 Año: 2001

SPECIAL ISSUE ON INTERCONNECTIONS -- ADDRESSING THE NEXT CHALLENGE OF IC TECHNOLOGY (PART II: DESIGN, CHARACTERIZATION, AND MODELING) - PAPERS - Clock Distribution Networks in Synchronous Digital Integrated Circuits (Invited Paper)

Revista: PROCEEDINGS OF THE IEEE    Formato: Impreso

Tabla de contenido: Vol: 89 Num: 5 Par: 0 Año: 2001

SPECIAL ISSUE ON INTERCONNECTIONS -- ADDRESSING THE NEXT CHALLENGE OF IC TECHNOLOGY (PART II: DESIGN, CHARACTERIZATION, AND MODELING) - PAPERS - Simulation of High-Speed Interconnects (Invited Paper)

Revista: PROCEEDINGS OF THE IEEE    Formato: Impreso

Tabla de contenido: Vol: 89 Num: 5 Par: 0 Año: 2001

SPECIAL ISSUE ON INTERCONNECTIONS -- ADDRESSING THE NEXT CHALLENGE OF IC TECHNOLOGY (PART II: DESIGN, CHARACTERIZATION, AND MODELING) - PAPERS - Progress in the Methodologies for the Electrical Modeling of Interconnects and Electronic Packages (Invited Pa

Revista: PROCEEDINGS OF THE IEEE    Formato: Impreso

Tabla de contenido: Vol: 89 Num: 5 Par: 0 Año: 2001

SPECIAL ISSUE ON INTERCONNECTIONS -- ADDRESSING THE NEXT CHALLENGE OF IC TECHNOLOGY (PART II: DESIGN, CHARACTERIZATION, AND MODELING) - PAPERS - Moment Computation of Lumped and Distributed Coupled RC Trees with Application to Delay and Crosstalk Estimati

Revista: PROCEEDINGS OF THE IEEE    Formato: Impreso

Tabla de contenido: Vol: 89 Num: 5 Par: 0 Año: 2001

SPECIAL ISSUE ON INTERCONNECTIONS -- ADDRESSING THE NEXT CHALLENGE OF IC TECHNOLOGY (PART II: DESIGN, CHARACTERIZATION, AND MODELING) - COMMENTS - Correction to "Semiconductor Characterization and Analytical Technology"

Revista: PROCEEDINGS OF THE IEEE    Formato: Impreso

Tabla de contenido: Vol: 89 Num: 5 Par: 0 Año: 2001