4   Artículos

SPECIAL ISSUE ON INTERCONNECTIONS -- ADDRESSING THE NEXT CHALLENGE OF IC TECHNOLOGY (PART II: DESIGN, CHARACTERIZATION, AND MODELING) - PAPERS - Progress in the Methodologies for the Electrical Modeling of Interconnects and Electronic Packages (Invited Pa

Revista: PROCEEDINGS OF THE IEEE    Formato: Impreso

Tabla de contenido: Vol: 89 Num: 5 Par: 0 Año: 2001

MINI-SPECIAL ISSUE PAPERS - Systematic Development of Transmission-Line Models for Interconnects With Frequency-Dependent Losses

Revista: IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES    Formato: Impreso

Tabla de contenido: Vol: 49 Num: 10(1) Par: 0 Año: 2001

MINI-SPECIAL ISSUE PAPERS - Enhanced Skin Effect for Partial-Element Equivalent-Circuit (PEEC) Models

Revista: IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES    Formato: Impreso

Tabla de contenido: Vol: 48 Num: 9 Par: 0 Año: 2000

Hybrid Electromagnetic Modeling of Noise Interactions in Packaged Electronics Based on the Partial-Element Equivalent-Circuit Formulation

Revista: IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES    Formato: Impreso

Tabla de contenido: Vol: 45 Num: 10 (2) Par: 0 Año: 1997