ARTÍCULO
TITULO

SPECIAL ISSUE ON INTERCONNECTIONS -- ADDRESSING THE NEXT CHALLENGE OF IC TECHNOLOGY (PART II: DESIGN, CHARACTERIZATION, AND MODELING) - Scanning the Special Issue on Interconnections -- Addressing the Next Challenge of IC Technology (Part II: Design, Char

Schutt-Ainé    
    
J E    
Kang    
S-M    

Resumen

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