Inicio  /  WELDING JOURNAL  /  Vol: 81 Núm: 6 Par: 0 (2002)  /  Artículo
ARTÍCULO
TITULO

The Stress Field Characteristics in the Surface Mount Solder Joints under Temperature Cycling: Temperature Effect and Its Evaluation

Qian    
Y. Y. Ma    
X. Yoshida    
F.    

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