ARTÍCULO
TITULO

Signal Integrity Flow for System-in-Package and Package-on-Package Devices

Pulici    
P.    
Vanalli    
G.P.    
Dellutri    
M.A.    
Guarnaccia    
D.    
Lo Iacono    
F.    
Campardo    
G.    
Ripamonti    
G.    

Resumen

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