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Sachin Dhull,Ravinderjit Singh Walia,Qasim Murtaza,Mahendra Singh Niranjan
Pág. 1834 - 1849
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Ephraim Suhir and Reza Ghaffarian
In this review, some major aspects of the current underfill technologies for flip-chip (FC) and fine-pitch-ball-grid-array (FPBGA), including chip-size packaging (CSP), are addressed, with an emphasis on applications, such as aerospace electronics, for w...
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Romain Michon, Julius Orion Smith, Matthew Wright, Chris Chafe, John Granzow and Ge Wang
Two concepts are presented, extended, and unified in this paper: mobile device augmentation towards musical instruments design and the concept of hybrid instruments. The first consists of using mobile devices at the heart of novel musical instruments. Sm...
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Huan Liu, Xudong Fang, Le Meng and Shanshan Wang
Spin coating is one of the dominant processes for producing photoresistant thin films in integrated circuit manufacturing. The application of this process mainly focuses on flat surfaces. With the development of science and technology, the spin coating p...
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Malik M. A. Khalfan, Salman Azhar, Tayyab Maqsood
Pág. 13 - 14
The Architecture, Engineering and Construction (AEC) industries have long sought techniques to decrease project cost, increase productivity and quality, enhance safety, and reduce project delivery time. Building Information Modeling (BIM) offers the pote...
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