Inicio  /  SCRIPTA MATERIALIA  /  Vol: 60 Núm: 5 Par: 0 (2009)  /  Artículo
ARTÍCULO
TITULO

Initial formation of CuSn intermetallic compounds between molten SnAgCu solder and Cu substrate

Jicheng Gong    
Changqing Liu    
Paul P. Conway    
Vadim V. Silberschmidt    

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