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Muhammad Yasar Razzaq, Joamin Gonzalez-Gutierrez, Gregory Mertz, David Ruch, Daniel F. Schmidt and Stephan Westermann
Four-dimensional (4D) printing technology, as a next-generation additive manufacturing method, enables printed objects to further change their shapes, functionalities, or properties upon exposure to external stimuli. The 4D printing of programmable and d...
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Hugo Hultman, Stefan Cedergren, Kristina Wärmefjord and Rikard Söderberg
The aerospace industry faces constantly increasing demands on performance and reliability, especially within the vital area of engine development. New technologies are needed in order to push the limits of high precision manufacturing processes for the n...
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Christos V. Katsiropoulos, Spiros G. Pantelakis, Marco Barile and Leonardo Lecce
?he development of a novel hybrid thermoplastic prepreg material enabling the fabrication of next-generation recyclable composite aerostructures produced by affordable, automated technologies is presented in the present work. The new hybrid material is p...
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Chhandak Mukherjee, Marina Deng, Virginie Nodjiadjim, Muriel Riet, Colin Mismer, Djeber Guendouz, Christophe Caillaud, Hervé Bertin, Nicolas Vaissiere, Mathieu Luisier, Xin Wen, Magali De Matos, Patrick Mounaix and Cristell Maneux
This review paper reports the prerequisites of a monolithic integrated terahertz (THz) technology capable of meeting the network capacity requirements of beyond-5G wireless communications system (WCS). Keeping in mind that the terahertz signal generation...
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Konstantinos Papatryfonos, David R. Selviah, Avi Maman, Kobi Hasharoni, Antoine Brimont, Andrea Zanzi, Jochen Kraft, Victor Sidorov, Marc Seifried, Yannick Baumgartner, Folkert Horst, Bert Jan Offrein, Katarzyna Lawniczuk, Ronald G. Broeke, Nikos Terzenidis, George Mourgias-Alexandris, Mingchu Tang, Alwyn J. Seeds, Huiyun Liu, Pablo Sanchis, Miltiadis Moralis-Pegios, Thanasis Manolis, Nikos Pleros, Konstantinos Vyrsokinos, Bogdan Sirbu, Yann Eichhammer, Hermann Oppermann and Tolga Tekinadd Show full author list remove Hide full author list
We report recent advances in photonic?electronic integration developed in the European research project L3MATRIX. The aim of the project was to demonstrate the basic building blocks of a co-packaged optical system. Two-dimensional silicon photonics array...
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