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Sijiao Wang, Kaiming Cao, Guanwei Wang, Mengmeng Chen and Hongxi Wang
Epoxy resin is one of the most widely used thermosetting polymers and commonly applied in power electronics field. The intrinsic properties of epoxy can be improved by the introduction of inorganic filler, thus fabricating a composite material. In this p...
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Mina Dadvand and Oumarou Savadogo
Crack-free and uniform nickel?tungsten (NiW) coatings and their composite coatings filled with ceramic particles such as silicon carbide (SiC) and hexagonal-boron nitride (hBN) were deposited on brass substrates by applying direct current (DC) waveforms....
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Chil Hyoung Lee, Go Bong Choi, Eun Mi Kim, Jongho Lee, Jaegeun Lee, Hi Gyu Moon, Myung Jong Kim, Yoong Ahm Kim and Tae Hoon Seo
The demand for high-performance two-dimensional gas barrier materials is increasing owing to their potential for application in optoelectronic devices. These materials can help the devices maintain their properties over a long period. Therefore, in this ...
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Yang Gao, Xiaoqiang Ren, Jiang Han, Fuwei Wang, Yuan Liang and Lin Liu
The microtopography of a honing wheel surface composed of active abrasive grains is the key factor affecting the honing characteristics, and control of it is a sufficient condition to realize high-efficiency precision honing. Based on the magnetron sputt...
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Giacomo Riccucci, Lorenzo Pezzana, Simone Lantean, Alice Tori, Silvia Spriano and Marco Sangermano
Thermal conductivity is a key property in many applications from electronic to informatics. The interaction of fillers with Sylgard 184 was studied; this study explores new composites and the influence of metal particles (copper and nickel), carbon-based...
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