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Inicio  /  Applied Sciences  /  Vol: 10 Par: 23 (2020)  /  Artículo
ARTÍCULO
TITULO

Detecting and Measuring Defects in Wafer Die Using GAN and YOLOv3

Ssu-Han Chen    
Chih-Hsiang Kang and Der-Baau Perng    

Resumen

Die defect detection and measurement.

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